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 DS80C310 High-Speed Micro
www.dalsemi.com
FEATURES
80C32-compatible - 8051 pin- and instruction set-compatible - Full duplex serial port - Three 16-bit timer/counters - 256 bytes scratchpad RAM - Multiplexed address/data bus - Addresses 64 kB ROM and 64 kB RAM High-Speed Architecture - 4 clocks/machine cycle (8051 = 12) - Runs DC to 33 MHz clock rates - Single-cycle instruction in 121 ns - Dual data pointer - Optional variable length MOVX to access fast/slow RAM /peripherals 10 total interrupt sources with 6 external Internal power-on reset circuit Upwardly compatible with the DS80C320 Available in 40-pin PDIP, 44-pin PLCC, and 44-pin TQFP
PACKAGE OUTLINE
DESCRIPTION
The DS80C310 is a fast 80C31/80C32-compatible microcontroller. It features a redesigned processor core without wasted clock and memory cycles. As a result, it executes every 8051 instruction between 1.5 and 3 times faster than the original architecture for the same crystal speed. Typical applications will see a speed improvement of 2.5 times using the same code and the same crystal. The DS80C310 offers a maximum crystal speed of 33 MHz, resulting in apparent execution speeds of 82.5 MHz (approximately 2.5X). 1 of 23 112299
DS87C520/DS83C520
The DS80C310 is pin-compatible with the standard 80C32 and includes standard resources such as three timer/counters, 256 bytes of RAM, and a serial port. It also provides dual data pointers (DPTRs) to speed block data memory moves. It also can adjust the speed of MOVX data memory access between two and nine machine cycles for flexibility in selecting external memory and peripherals. The DS80C310 offers upward compatibility with the DS80C320.
ORDERING INFORMATION:
PART NUMBER DS80C310-MCG DS80C310-QCG DS80C310-ECG DS80C310-MCL DS80C310-QCL DS80C310-ECL PACKAGE 40-pin plastic DIP 44-pin PLCC 44-pin TQFP 40-pin plastic DIP 44-pin PLCC 44-pin TQFP MAX. CLOCK SPEED 25 MHz 25 MHz 25 MHz 33 MHz 33 MHz 33 MHz TEMPERATURE RANGE 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C
DS80C310 BLOCK DIAGRAM Figure 1
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PIN DESCRIPTION Table 1
DIP 40 20 9 PLCC 44 22,23 1 10 TQFP 38 16,17, 39 4 SIGNAL NAME VCC GND RST DESCRIPTION VCC -+5V. GND- Digital circuit ground. RST - Input. The RST input pin contains a Schmitt voltage input to recognize external active high reset inputs. The pin also employs an internal pulldown resistor to allow for a combination of wired OR external Reset sources. XTAL1, XTAL2 - The crystal oscillator pins XTAL1 and XTAL2 provide support for parallel resonant, AT cut crystals. XTAL1 acts also as an input in the event that an external clock source is used in place of a crystal. XTAL2 serves as the output of the crystal amplifier. PSEN - Output. The Program Store Enable output. This signal is commonly connected to external ROM memory as a chip enable. PSEN is active low. PSEN is driven high when data memory (RAM) is being accessed through the bus and during a reset condition. ALE - Output. The Address Latch Enable output functions as clock to latch the external address LSB from the multiplexed address/data bus on Port 0. This signal is commonly connected to the latch enable of an external 373 family transparent latch.ALE is forced high when the DS80C310 is in a Reset condition. AD0-7 (Port 0) - I/O. Port 0 is the multiplexed address/data bus. During the time when ALE is high, the LSB of a memory address is presented. When ALE falls to a logic 0, the port transitions to a bidirectional data bus. This bus is used to read external ROM and read/write external RAM memory or peripherals. Port 0 has no true port latch and can not be written directly by software. The reset condition of Port 0 is high. Port 1 - I/O. Port 1 functions as both an 8-bit bidirectional I/O port and an alternate functional interface for Timer 2 I/O and new External Interrupts. The reset condition of Port 1 is with all bits at a logic 1. In this state, a weak pullup holds the port high. This condition also serves as an input mode, since any external circuit that writes to the port will overcome the weak pullup. When software writes a 0 to any port pin, the DS80C310 will activate a strong pulldown that remains on until either a 1 is written or a reset occurs. Writing a 1 after the port has been at 0 will cause a strong transition driver to turn on, followed by a weaker sustaining pullup. Once the momentary strong driver turns off, the port once again becomes the output high (and input) state. The alternate modes of Port 1 are outlined as follows:
18 19
20 21
14 15
XTAL2 XTAL1
29
32
26
PSEN
30
33
27
ALE
39 38 37 36 35 34 33 32 1-8
43 42 41 40 39 38 37 36 2-9
37 36 35 34 33 32 31 30 40-44 1-3
AD0 (P0.0) AD1 (P0.1) AD2 (P0.2) AD3 (P0.3) AD4 (P0.4) AD5 (P0.5) AD6 (P0.6) AD7 (P0.7) P1.0-P1.7
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DIP
PLCC
TQFP
SIGNAL NAME
DESCRIPTION Port Alternate Function P1.0 T2 External I/O for Timer/Counter 2 P1.1 T2EX Timer/Counter 2 Capture/Reload Trigger P1.2 none (DS80C320 has a serial port RXD) P1.3 none (DS80C320 has a serial port TXD) P1.4 INT2 External Interrupt 2 (Positive Edge Detect) P1.5 INT3 External Interrupt 3 (Negative Edge Detect) P1.6 INT4 External Interrupt 4 (Positive Edge Detect) External Interrupt 5 (Negative Edge Detect) P1.7 INT5 A8-15 (Port 2) -Output. Port 2 serves as the MSB for external addressing. P2.7 is A15 and P2.0 is A8. The DS80C310 will automatically place the MSB of an address on P2 for external ROM and RAM access. Although Port 2 can be accessed like an ordinary I/O port, the value stored on the Port 2 latch will never be seen on the pins (due to memory access). Therefore writing to Port 2 in software is only useful for the instructions MOVX A, @ Ri or MOVX @ Ri, A. These instructions use the Port 2 internal latch to supply the external address MSB; the Port 2 latch value will be supplied as the address information. Port 3 - I/O. Port 3 functions as both an 8-bit bidirectional I/O port and an alternate functional interface for external Interrupts, Serial Port 0, Timer 0 and 1 Inputs, RD and WR strobes. The reset condition of Port 3 is with all bits at a logic 1. In this state, a weak pullup holds the port high. This condition also serves as an input mode, since any external circuit that writes to the port will overcome the weak pullup. When software writes a 0 to any port pin, the DS80C310 will activate a strong pulldown that remains on until either a 1 is written or a reset occurs. Writing a 1 after the port has been at 0 will cause a strong transition driver to turn on, followed by a weaker sustaining pullup. Once the momentary strong driver turns off, the port once again becomes both the output high and input state. The alternate modes of Port 3 are outlined below. Port Alternate Mode P3.0 RXD0 Serial Port 0 Input P3.1 TXD0 Serial Port 0 Output P3.2 INT0 External Interrupt 0 External Interrupt 1 P3.3 INT1 P3.4 T0 Timer 0 External Input P3.5 T1 Timer 1 External Input P3.6 WR External Data Memory Write Strobe P3.7 RD External Data Memory Read Strobe EA - Input. This pin must be connected to ground for proper operation. NC - Reserved. These pins should not be connected. They are reserved for use with future devices in this family. 4 of 23
1 2 3 4 5 6 7 8 21 22 23 24 25 26 27 28
2 3 4 5 6 7 8 9 24 25 26 27 28 29 30 31
40 41 42 43 44 1 2 3 18 19 20 21 22 23 24 25
A8 (P2.0) A9 (P2.1) A10(P2.2) A11(P2.3) A12(P2.4) A13 P2.5) A14(P2.6) A15(P2.7)
10-17
11, 13-19
5,7-13
P3.0-3.7
10 11 12 13 14 15 16 17 31 -
11 13 14 15 16 17 18 19 35 12 34
5 7 8 9 10 11 12 13 29 6 28
EA
NC
DS87C520/DS83C520
COMPATIBILITY
The DS80C310 is a fully static CMOS 8051-compatible microcontroller designed for high performance. In most cases the DS80C310 can drop into an existing socket for the 80C31 or 80C32 to improve the operation significantly. In general, software written for existing 8051-based systems works without modification on the DS80C310. The exception is critical timing since the High-Speed Micro performs its instructions much faster than the original for any given crystal selection. The DS80C310 runs the standard 8051 family instruction set and is pin compatible with DIP, PLCC or TQFP packages. The DS80C310 is a streamlined version of the DS80C320. It maintains upward compatibility but has fewer peripherals. The DS80C310 provides three 16-bit timer/counters, a full-duplex serial port, and 256 bytes of direct RAM. I/O ports have the same operation as a standard 8051 product. Timers will default to a 12-clock per cycle operation to keep their timing compatible with original 8051 family systems. However, timers are individually programmable to run at the new 4 clocks per cycle if desired. The DS80C310 provides several new hardware functions that are controlled by Special Function registers. A summary of the Special Function Registers is provided in Table 2.
PERFORMANCE OVERVIEW
The DS80C310 features a high-speed 8051 compatible core. Higher speed comes not just from increasing the clock frequency, but from a newer, more efficient design. This updated core does not have the dummy memory cycles that are present in a standard 8051. A conventional 8051 generates machine cycles using the clock frequency divided by 12. In the DS80C310, the same machine cycle takes four clocks. Thus the fastest instruction, 1 machine cycle, executes three times faster for the same crystal frequency. Note that these are identical instructions. The majority of instructions on the DS80C310 will see the full 3 to 1 speed improvement. Some instructions will get between 1.5 and 2.4 to 1 improvement. All instructions are faster than the original 8051. The numerical average of all opcodes gives approximately a 2.5 to 1 speed improvement. Improvement of individual programs will depend on the actual instructions used. Speed-sensitive applications would make the most use of instructions that are three times faster. However, the sheer number of 3 to 1 improved opcodes makes dramatic speed improvements likely for any code. These architecture improvements and 0.8 m CMOS produce a peak instruction cycle in 121 ns (8.25 MIPs). The Dual Data Pointer feature also allows the user to eliminate wasted instructions when moving blocks of memory.
INSTRUCTION SET SUMMARY
All instructions in the DS80C310 perform the same functions as their 8051 counterparts. Their effect on bits, flags, and other status functions is identical. However, the timing of each instruction is different. This applies both in absolute and relative number of clocks. For absolute timing of real time events, the timing of software loops can be calculated using a table in the High-Speed Microcontroller User's Guide. However, counter/timers default to run at the older 12 clocks per increment. In this way, timer-based events occur at the standard intervals with software executing at higher speed. Timers optionally can run at 4 clocks per increment to take advantage of faster processor operation. The relative time of two instructions might be different in the new architecture than it was previously. For example, in the original architecture the "MOVX A, @ DPTR" instruction and the "MOV direct, direct" instruction used two machine cycles or 24 oscillator cycles. Therefore, they required the same amount of 5 of 23
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time. In the DS80C310, the MOVX instruction takes as little as two machine cycles or eight oscillator cycles but the "MOV direct, direct" uses three machine cycles or 12 oscillator cycles. While both are faster than their original counterparts, they now have different execution times. This is because the DS80C310 usually uses one instruction cycle for each instruction byte. The user concerned with precise program timing should examine the timing of each instruction for familiarity with the changes. Note that a machine cycle now requires just four clocks, and provides one ALE pulse per cycle. Many instructions require only one cycle, but some require five. In the original architecture, all were one or two cycles except for MUL and DIV. Refer to the High-Speed Microcontroller User's Guide for details and individual instruction timing.
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SPECIAL FUNCTION REGISTERS
Special Function Registers (SFRs) control most special features of the DS80C310. The High-Speed Microcontroller User's Guide describes all SFRs. Functions that are not part of the standard 80C32 are in bold.
SPECIAL FUNCTION REGISTERS Table 2
REGISTER BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 ADDRESS
SP DPL DPH DPL1 DPH1 DPS PCON TCON TMOD TL0 TL1 TH0 TH1 CKCON P1 EXIF SCON SBUF P2 IE SADDR0 P3 IP SADEN0 STATUS T2CON T2MOD RCAP2L RCAP2H TL2 TH2 PSW WDCON ACC EIE B EIP
0 SMOD TF1 GATE
0 SM0D0 TR1 C/ T
0 TF0 M1
0 TR0 M0
0 GF1 IE1 GATE
0 GF0 IT1 C/ T
0 STOP IE0 M1
SEL IDLE IT0 M0
P1.7 IE5 SMO/FE P2.7 EA P3.7 0 TF2 -
P1.6 IE4 SM1 P2.6 P3.6 HIP EXF2 -
T2M P1.5 IE3 SM2 P2.5 ET2 P3.5 PT2 LIP RCLK -
T1M P1.4 IE2 REN P2.4 ES0 P3.4 PSO 1 TCLK -
T0M P1.3 TB8 P2.3 ET1 P3.3 PT1 1 EXEN2 -
MD2 P1.2 RB8 P2.2 EX1 P3.2 PX1 1 TR2 -
MD1 P1.1 TI P2.1 ET0 P3.1 PT0
MD0 P1.0 RI P2.0 EX0 P3.0 PX0
1 1 C/ T2 CP/ RL2 T2OE DCEN
CY -
AC POR -
F0 -
RS1 -
RS0 EX5 PX5
OV EX4 PX4
FL EX3 PX3
P EX2 PX2
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MEMORY ACCESS
The DS80C310 contains no on-chip ROM, and 256 bytes of scratchpad RAM. Off-chip memory is accessed using the multiplexed address/data bus on P0 and the MSB address on P2. Timing diagrams are provided in the Electrical Specifications. Program memory (ROM) is accessed at a fixed rate determined by the crystal frequency and the actual instructions. As mentioned above, an instruction cycle requires four clocks. Data memory (RAM) is accessed according to a variable speed MOVX instruction as described below.
STRETCH MEMORY CYCLE
The DS80C310 allows the application software to adjust the speed of data memory access. The micro is capable of performing the MOVX in as few as two instruction cycles. However, this value can be stretched as needed so that both fast memory and slow memory or peripherals can be accessed with no glue logic. Even in highspeed systems, it may not be necessary or desirable to perform data memory access at full speed. In addition, there are a variety of memory mapped peripherals such as LCD displays or UARTs that are not fast. The Stretch MOVX is controlled by the Clock Control Register at SFR location 8Eh as described below. This allows the user to select a stretch value between 0 and 7. A Stretch of 0 will result in a two-machine cycle MOVX. A Stretch of 7 will result in a MOVX of nine machine cycles. Software can dynamically change this value depending on the particular memory or peripheral. On reset, the Stretch value will default to a one resulting in a three-cycle MOVX. Therefore, RAM access will not be performed at full speed. This is a convenience to existing designs that may not have fast RAM in place. When maximum speed is desired, the software should select a Stretch value of 0. When using very slow RAM or peripherals, a larger stretch value can be selected. Note that this affects data memory only and the only way to slow program memory (ROM) access is to use a slower crystal. Using a Stretch value between 1 and 7 causes the microcontroller to stretch the read/write strobe and all related timing. This results in a wider read/write strobe allowing more time for memory/peripherals to respond. The timing of the variable speed MOVX is shown in the Electrical Specifications. Note that full speed access is not the reset default case. Table 3 shows the resulting strobe widths for each Stretch value. The memory stretch is implemented using the Clock Control Special Function Register at SFR location 8Eh. The stretch value is selected using bits CKCON.2-0. In the table, these bits are referred to as M2 through M0. The first stretch (default) allows the use of common 120 ns or 150 ns RAMs without dramatically lengthening the memory access.
DATA MEMORY CYCLE STRETCH VALUES Table 3
CKCON.2-0 M2 M1 M0 0 0 0 0 0 1 0 1 0 0 1 1 1 0 0 1 0 1 1 1 0 1 1 1 MEMORY CYCLES 2 3(default) 4 5 6 7 8 9 RD OR WR STROBE WIDTH IN CLOCKS 2 4 8 12 16 20 24 28 STROBE WIDTH TIME @ 25 MHz @ 33 MHz 80 ns 60ns 160 ns 121ns 320 ns 242ns 480 ns 364ns 640 ns 485ns 800 ns 606ns 960 ns 727ns 1120 ns 848ns
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DUAL DATA POINTER
Data memory block moves can be accelerated using the DS80C310 Dual Data Pointer (DPTR). The standard 8032 DPTR is a 16-bit value that is used to address off-chip data RAM or peripherals. In the DS80C310, the standard data pointer is called DPTR and is located at SFR addresses 82h and 83h. These are the standard locations. No modification of standard code is needed to use DPTR. The new DPTR is located at SFR 84h and 85h and is called DPTR1. The DPTR Select bit (DPS) chooses the active pointer and is located at the lsb of the SFR location 86h. No other bits in register 86h have any effect and are set to 0. The user switches between data pointers by toggling the lsb of register 86h. The increment (INC) instruction is the fastest way to accomplish this. All DPTR-related instructions use the currently selected DPTR for any activity. Therefore only one instruction is required to switch from a source to a destination address. Using the Dual Data Pointer saves code from needing to save source and destination addresses when doing a block move. Once loaded, the software simply switches between DPTR0 and 1. The relevant register locations are as follows. DPL DPH DPL1 DPH1 DPS 82h 83h 84h 85h 86h Low byte original DPTR High byte original DPTR Low byte new DPTR High byte new DPTR DPTR Select (lsb)
STOP MODE ENHANCEMENTS
Setting bit 1 of the Power Control register (PCON; 87h) invokes the Stop mode. Stop mode is the lowest power state since it turns off all internal clocking. The ICC of a standard Stop mode is approximately 1 A (but is specified in the Electrical Specifications). The CPU will exit Stop mode from an external interrupt or a reset condition. Internally generated interrupts are not useful since they require clocking activity. The DS80C310 allows a resume from Stop using an INT2-5, which are edge-triggered interrupts. The start-up timing is managed by an internal crystal counter. A delay of 65,536 clocks occurs to give the crystal enough time to start and stabilize.
PERIPHERAL OVERVIEW
The DS80C310 provides the same peripheral functions as the standard 80C32. It is compatible with the DS80C320 but does not offer all of the peripherals.
TIMER RATE CONTROL
There is one important difference between the DS80C310 and 8051 regarding timers. The original 8051 used 12 clocks per cycle for timers as well as for machine cycles. The DS80C310 architecture normally uses 4 clocks per machine cycle. However, in the area of timers and serial ports, the DS80C310 will default to 12 clocks per cycle on reset. This allows existing code with real-time dependencies such as baud rates to operate properly. If an application needs higher speed timers or serial baud rates, the user can select individual timers to run at the 4-clock rate. The Clock Control register (CKCON; 8Eh) determines these timer speeds. When the relevant CKCON bit is a logic 1, the DS80C310 uses 4 clocks per cycle to generate timer speeds. When the bit is a 0, the DS80C310 uses 12 clocks for timer speeds. The reset condition is a 0. CKCON.5 selects the speed of Timer 2. CKCON.4 selects Timer 1 and CKCON.3 selects Timer 0. Note that unless a user desires very fast timing, it is unnecessary to alter these bits. Note that the timer controls are independent.
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POWER ON RESET
The DS80C310 will hold itself in reset during a power-up until 65,536 clock cycles have elapsed. The power-on reset used by the DS80C310 differs somewhat from other members of the High-Speed Microcontroller family. The crystal oscillator may start anywhere between 1.0V and 4.5V but is not specified. This eliminates the need for an RC reset circuit. For voltage-specific precision brownout detection, an external component will be needed. When the device goes through a power-on reset, the POR flag will be set in the WDCON (D8h) register at bit 6.
INTERRUPTS
The DS80C310 provides 10 interrupt sources with two priority levels. Software can assign high or low priority to all sources. All interrupts that are new to the 8051 have a lower natural priority than the originals.
INTERRUPT SOURCES AND PRIORITIES Table 4
NAME INT0 TF0 INT1 TF1 SCON TF2 INT2 INT3 INT4 INT5 DESCRIPTION External Interrupt 0 Timer 0 External Interrupt 1 Timer 1 T1 or R1 from the serial port Timer 2 External Interrupt 2 External Interrupt 3 External Interrupt 4 External Interrupt 5 VECTOR 03h 0Bh 13h 1Bh 23h 2Bh 43h 4Bh 53h 5Bh NATURAL PRIORITY 1 2 3 4 5 6 7 8 9 10
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ABSOLUTE MAXIMUM RATINGS*
Voltage on Any Pin Relative to Ground Operating Temperature Storage Temperature Soldering Temperature
-0.3V to +7.0V 0C to 70C -55C to +125C 260C for 10 seconds
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.
DC ELECTRICAL CHARACTERISTICS
PARAMETER Supply Voltage Supply Current Active Mode @ 33 MHz Supply Current Idle Mode @ 33 MHz Supply Current Stop Mode Input Low Level Input High Level (Except XTAL1 and RST) Input High Level XTAL1 and RST Output Low Voltage Ports 1,3 @ IOL = 1.6 mA Output Low Voltage Port 0,2, ALE, PSEN @ IOL =3.2 mA Output High Voltage Port 1, 3, ALE, PSEN @ IOH =-50 A Output High Voltage @ IOH =-1.5mA Ports 1,3 Output High Voltage Port 0, 2, ALE, PSEN @ IOH =-8 mA Input Low Current Ports 1, 3 @ 0.45V Transition Current from 1 to 0 Ports 1,3 @ 2V Input Leakage Port 0, Bus Mode RST Pulldown Resistance SYMBOL MIN VCC 4.0 ICC IIDLE ISTOP VIL VIH VIH2 VOL1 VOL2 VOH1 VOH2 VOH3 IIL ITL IL RRST -300 50 2.4 2.4 2.4 -55 -650 300 170 -0.3 2.0 3.5 0.15 0.15 TYP 5.0 30 15 1 +0.8 VCC+0.3 VCC+0.3 0.45 0.45 MAX 5.5 UNITS V mA mA
A V
NOTES 1 2 3 4 1 1 1 1 1, 5 1, 6 1, 7 1, 5 10 8 9
V V V V V V V
A A A K
NOTES FOR DC ELECTRICAL CHARACTERISTICS:
All parameters apply to both commercial and industrial temperature operation unless otherwise noted. 1. All voltages are referenced to ground. 2. Active current is measured with a 33 MHz clock source driving XTAL1, VCC =RST=5.5V, all other pins disconnected.
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3. Idle mode current is measured with a 33 MHz clock source driving XTAL1, VCC =5.5V, RST at ground, all other pins disconnected. 4. Stop mode current measured with XTAL1 and RST grounded, VCC =5.5V, all other pins disconnected. 5. When addressing external memory. 6. RST=VCC. This condition mimics operation of pins in I/O mode. 7. During a 0 to 1 transition, a one-shot drives the ports hard for two clock cycles. This measurement reflects port in transition mode. 8. Ports 1 and 3 source transition current when being pulled down externally. It reaches its maximum at approximately 2V. 9. 0.45DS80C310. Peak current occurs near the input transition point of the latch, approximately 2V. 10. Current required from external circuit to hold a logic low level on an I/O pin while the corresponding port latch bit is set to 1. This is only the current required to hold the low level; transitions from 1 to 0 on an I/O pin will also have to overcome the transition current.
TYPICAL ICC VERSUS FREQUENCY Figure 2
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AC ELECTRICAL CHARACTERISTICS
PARAMETER Oscillator Freq. (Ext. Osc.) (Ext. Crystal) ALe Pulse Width Port 0 Address Valid to ALE Low Address Hold after ALE Low ALE Low to Valid Instruction In ALE Low to PSEN Low PSEN Pulse Width PSEN Low to Valid Instr. In Input Instruction Hold after PSEN Input Instruction Float after PSEN Port 0 Address to Valid Instr. In Port 2 Address to Valid Instr. In PSEN Low to Address Float 25 MHz SYMBOL MIN MAX 0 33 1/tCLCL 1 33 tLHLL 40 tAVLL 10 tLLAX1 10 tLLIV 56 10 tLLPL tPLPH 55 tPLIV 41 tPXIX 0 tPXIZ 26 tAVIV 71 tAVIV2 81 tPLAZ 0 VARIABLE CLOCK MIN MAX 0 33 1 33 1.5tCLCL-5 0.5tCLCL-5 0.5tCLCL-5 2.5tCLCL-20 0.5tCLCL-5 2tCLCL-5 2tCLCL-20 0 tCLCL-5 3tCLCL-20 3.5tCLCL-25 0 NOTES MHz ns ns ns ns ns ns ns ns ns ns ns ns
NOTES FOR AC ELECTRICAL CHARACTERISTICS
All parameters apply to both commercial and industrial temperature range operation unless otherwise noted. All signals characterized with load capacitance of 80 pF except Port 0, ALE, PSEN , and WR with 100 pF. Interfacing to memory devices with float times (turn off times) over 25 ns may cause contention. This will not damage the parts, but will cause an increase in operating current. Specifications assume a 50% duty cycle for the oscillator. Port 2 and ALE timing will change in relation to duty cycle variation.
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MOVX CHARACTERISTICS
VARIABLE CLOCK PARAMETER SYMBOL
Data Access ALE Pulse Width Address Hold after ALE Low for MOVX Write RD Pulse Width
WR Pulse Width
RD
tLHLL2 tLLAX2 tRLRH tWLWH tRLDV tRHDX tRHDZ tLLDV tAVDV1
MIN 1.5tCLCL-5 2tCLCL-5 0.5tCLCL-5 tCLCL-5 2tCLCL-5 tMCS-10 2tCLCL-5 tMCS-10
MAX
UNITS
STRETCH
ns ns ns ns 2tCLCL-20 tMCS-20 ns ns tCLCL-5 2tCLCL-5 2.5tCLCL-20 tCLCL+tMCS-40 3tCLCL-20 1.5tCLCL+ tMCS 20 3.5tCLCL-20 2tCLCL+ tMCS-20 0.5tCLCL+5 tCLCL+5 ns ns ns ns ns ns ns ns ns -0.5tCLCL-5 10 tCLCL+5 ns ns
Low to Valid Data In
tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0 tMCS=0 tMCS>0
Data Hold after Read Data Float after Read ALE Low to Valid Data In Port 0 Address to Valid Data In
0
Port 2 Address to Valid Data In ALE Low to RD or WR Low Port 0 Address to RD or WR Low Port 2 Address to RD or WR Low Data Valid to WR Transition Data Hold after Write
RD RD
tAVDV2 tLLWL tAVWL1 tAVWL2 tQVWX tWHQX tRLAZ tWHLH 0 tCLCL-5 0.5tCLCL-5 tCLCL-5 tCLCL-5 2tCLCL-5 1.5tCLCL-10 2.5tCLCL-10 -5 tCLCL-5 2tCLCL-5
Low to Address Float or WR High to ALE High
NOTE: tMCS is a time period related to the Stretch memory cycle selection. The following table shows the value of tMCS for each Stretch selection. M2 M1 M0 MOVX CYCLES tMCS 0 0 0 2 machine cycles 0 0 0 1 3 machine cycles (default) 4 tCLCL 0 1 0 4 machine cycles 8 tCLCL 0 1 1 5 machine cycles 12 tCLCL 1 0 0 6 machine cycles 16 tCLCL 1 0 1 7 machine cycles 20 tCLCL 1 1 0 8 machine cycles 24 tCLCL 1 1 1 9 machine cycles 28 tCLCL
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EXTERNAL CLOCK CHARACTERISTICS
PARAMETER Clock High Time Clock Low Time Clock Rise Time Clock Fall Time SYMBOL tCHCX tCLCX tCLCL tCHCL MIN 10 10 TYP MAX UNITS ns ns ns ns NOTES
5 5
SERIAL PORT MODE 0 TIMING CHARACTERISTICS
PARAMETER Serial Port Clock Cycle Time SM2=0, 12 clocks per cycle SM2=1, 4 clocks per cycle Output Data Setup to Clock Rising SM2=0, 12 clocks per cycle SM2=1, 4 clocks per cycle Output Data Hold from Clock Rising SM2=0, 12 clocks per cycle SM2=1, 4 clocks per cycle Input Data Hold after Clock Rising SM2=0, 12 clocks per cycle SM2=1, 4 clocks per cycle Clock Rising Edge to Input Data Valid SM2=0, 12 clocks per cycle SM2=1, 4 clocks per cycle SYMBOL tXLXL MIN TYP 12tCLCL 4tCLCL 10tCLCL 3tCLCL MAX UNITS ns ns ns ns NOTES
tQVXH
tXHQX
2tCLCL tCLCL
ns ns
tXHDX
tCLCL tCLCL 11tCLCL 3tCLCL
ns ns
tXHDV
ns ns
EXPLANATION OF AC SYMBOLS
In an effort to remain compatible with the original 8051 family, this device specifies the same parameters as such devices, using the same symbols. For completeness, the following is an explanation of the symbols. t A C D H L I P Q R V W X Z Time Address Clock Input data Logic level high Logic level low Instruction
PSEN
Output data RD signal Valid WR signal No longer a valid logic level Tristate
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EXTERNAL PROGRAM MEMORY READ CYCLE
EXTERNAL DATA MEMORY READ CYCLE
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DATA MEMORY WRITE CYCLE
DATA MEMORY WRITE WITH STRETCH=1
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DS87C520/DS83C520
DATA MEMORY WRITE WITH STRETCH=2
EXTERNAL CLOCK DRIVE
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DS87C520/DS83C520
SERIAL PORT MODE 0 TIMING
SERIAL PORT 0 (SYNCHRONOUS MODE) HIGH-SPEED OPERATION SM2=1=>TXD CLOCK=XTAL/4
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DS87C520/DS83C520
40-PIN PDIP (600-MIL)
ALL DIMENSIONS ARE IN INCHES. PKG DIM A A1 A2 b c D E E1 e L eB 40-PIN MAX 0.200 0.160 0.022 0.012 2.085 0.625 0.555 0.110 0.145 0.700
MIN 0.015 0.140 0.014 0.008 1.980 0.600 0.530 0.090 0.115 0.600
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DS87C520/DS83C520
44-PIN PLCC
PKG DIM A A1 A2 B B1 c CH1 D D1 D2 E E1 E2 e1 N
44-PIN MIN MAX 0.165 0.180 0.090 0.120 0.020 0.026 0.033 0.013 0.021 0.009 0.012 0.042 0.048 0.685 0.695 0.650 0.656 0.590 0.630 0.685 0.695 0.650 0.656 0.590 0.630 0.050 BSC 44 -
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DS87C520/DS83C520
44-PIN TQFP
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DS87C520/DS83C520
PKG DIM A A1 A2 D D1 E E1 L e B C 56-G4012-001
44-PIN MIN MAX 1.20 0.05 0.15 0.95 1.05 11.80 12.20 10.00 BSC 11.80 12.20 10.00 BSC 0.45 0.75 0.80 BSC 0.30 0.45 0.09 0.20
DATA SHEET REVISION SUMMARY
The following represent the key differences between 02/19/98 and 09/01/98 version of the DS80C310 data sheet. Please review this summary carefully. 1. Add note to clarify IIL specification. 2. Change serial port mode 0 timing diagram label from tQVXL to tQVXH . 3. Changed minimum oscillator frequency to 1 MHz when using external crystal. 4. Corrected "Data memory write with stretch" diagrams to show falling edge of ALE coincident with rising edge of C3 clock.
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